Microelectronics Fabrication Facilities Vibration Measurement
Two 2 buildings consisting of a 5-story building and a 2-story building were installed with sensitive machines, which fabricate the microelectronics components such as external hard drives. Those require a free-vibration condition. Thus, 70 locations of machine vibration were measured. In each location, vibration in all three axes including two horizontal directions (X, Y) and one vertical direction (Z) were measured. Vibration was then interpreted into Vibration Criteria Curves (VCCs) defined as the relationship between One-Third Octave band Frequency and Root mean square velocity (RMS_V). This is known as a basic for designing and evaluating the performance of microelectronics fabrication facilities. Thereafter, these results were used for the machine “sitting” specification.